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Maturing of additive manufacturing (AM) techniques has increased their utilization for fabricating radio frequency (RF) and microwave devices. Solid composites used in material extrusion AM have experienced considerable expansion over the past decade, incorporating functional properties into 3D-printed objects. There are encouraging indications from AM material research that electrically efficient AM materials can be discovered. These materials would be useful for producing microwave components in the future. One of the enabling techniques for fabricating these materials is to incorporate nano/microparticles or fillers into thermoplastic material. Composite material 3D printing is a novel approach to managing materials’ microwave properties. While extrinsic qualities (effective permittivity) can be controlled by shape and porosity management, intrinsic attributes are tied to the composition of composites. Furthermore, combining various materials to increase the spectrum of available microwave characteristics is made possible by multi-material 3D printing. In this chapter, we explore different methodologies to fabricate ceramic/thermoplastic composites for fused deposition modeling (FDM) of RF and microwave devices. Analytical models for predicting effective permittivity of the composite are discussed and application examples of FDM printed RF, microwave and mm-wave devices employing composites are presented. 

This study investigates the integration of reduced graphene oxide (rGO) films as ground plane in miniaturized RF/mm-wave systems for advanced thermal management applications. Traditional methods such as copper-based heat spreaders struggle to handle the increased power and tighter integration requirements of modern day RF/mmWave packaging. Due to rGO’s exceptionally high in-plane thermal conductivity (∼1100 W/mK), when compared with copper (∼400 W/mK), rGO emerges as a compelling candidate for thermal management in RF electronic packaging. This study investigates the use of rGO to form a ground plane in RF and microwave electronics, evaluating its performance through meticulous transmission line simulations and measurements. Our findings reveal that rGO ground planes exhibit high signal integrity, with an average loss of about 1 dB at 10 GHz and around 2 dB up to 26 GHz, comparable to the performance of traditional copper ground planes. These results indicate that rGO is a promising material for RF and microwave circuits, especially in applications requiring enhanced thermal management and mechanical flexibility.